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2020 Vol.14, Issue 2 Preview Page

Research Article

A Preliminary Simulation Study on an In-situ Test Based Calculation of the Linear Thermal Transmittance of Wall-window Joints

현장측정 창-벽체 접합부 선형열관류율 도출을 위한 시뮬레이션 기초연구

Jae-Sol Choi1
,
Chang-Min Kim2
,
Hyang-In Jang3
,
Eui-Jong Kim4*
최 재솔1
,
김 창민2
,
장 향인3
,
김 의종4*
1Ph.D. Program Student, Graduate school, Department of Architecture, Inha University
2Head Research Engineer, Institute of Green Building and New Technology, Mirae Environment Plan
3Director, Institute of Green Building and New Technology, Mirae Environment Plan
4Associate Professor, Department of Architecture, Inha University
1인하대학교 건축학부 대학원 박사과정
2(주)미래환경플랜건축사사무소 건축친환경신기술연구소 실장
3(주)미래환경플랜건축사사무소 건축친환경신기술연구소 소장
4인하대학교 건축학부 부교수
* Corresponding Author
30 April 2020. pp. 171-182
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Abstract

This paper is a preliminary study on a quantitative evaluation of the thermal bridge through window-wall joint based on infrared thermography. The purpose of the work is to check the possibility of deducing the linear thermal transmittance from the thermal images, but in this preliminary work, the images were obtained not from an infrared camera but from simulations. A reference model is proposed to describe a construction defect case on the window-wall joint. Above all, the linear thermal transmittance of the defect case and the reference model was derived through the steady-state simulation. The reference model could describe the defective case showing a similar linear thermal transmittance when iteratively modifying a joint thermal property of the reference model. Surface temperatures of the surrounding area of the window were checked under unsteady conditions, and the temperature difference was 0.012°C on average. This result may show that the similar process can be performed but inversely in in-situ tests to get the linear thermal transmittance by modifying the joint property to match the thermal image and the simulated surface temperatures.

Keywords
Window construction fault
Infrared thermography
Simulation
Linear thermal transmittance

키워드
창호시공하자
열화상
시뮬레이션
선형열관류율
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Information
  • Publisher :Korean Institute of Architectural Sustainable Environment and Building Systems
  • Publisher(Ko) :한국건축친환경설비학회
  • Journal Title :Journal of Korean Institute of Architectural Sustainable Environment and Building Systems
  • Journal Title(Ko) :한국건축친환경설비학회논문집
  • Volume : 14
  • No :2
  • Pages :171-182
  • Received Date : 2019-12-03
  • Revised Date : 2020-03-03
  • Accepted Date : 2020-03-06
  • DOI :https://doi.org/10.22696/jkiaebs.20200016
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